B.V.H Board

Layer : 6Layer ~ 24Layer
Min Trace & Space : 3mil / 3mil
Material : FR-4, High TG FR4
Thickness : 0.4mm ~ 10.0mm
Cu(In/Ex) : 1/2oz ~ 10Oz
Finish : OSP, HASL, Gold Plating
Min Hole : 0.2mm

PRODUCT
Cell Phone, Equipment etc.

 
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