QUICK TURN FRAME

Single / Double Side Board

*Note
Rigid PWB
RigidFlex PWB
Flex PWB
Layers Quick-turn Standard Quick-turn Standard Quick-turn Standard
1-2L
2-Days
4-Days
3-Days
6-Days
4-8L
3-Days
5-Days
7-Days
14-Days
6-Days
10-Days
10-16L
6-Days
8-Days
14-Days
21-Days
10-Days
21-Days
18-36L
8-Days
12-Days
21-Days
45-Days

*Note: Non-standard requirement will impact this table.
(+ delivery leadtime 1 day)

PCB MANUFACTURING FLOW

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>

Lamination Process
Drill Process

Copper Plating

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<

AOI Process

Etching Process
Imaging Process

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OR
Solder Mask
Gold Plating

HASL or OSP

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<

Final Inspection
Bare Board Test
Router

 

 

RIGID FLEX DESIGN METHOD

3D Packaging

Maximizes Space Through The Use of X, Y, and Z Axes.
Reduces/Automates Assembly Operations.
Reduces Part Numbers To Procure
Maintains Signal Integrity
Provides For A Lighter And Reliable Product
Simply Gives You With A Competitive Edge

Preface 

The following is a quick design guideline for Rigid Flex and is directly related to the flex portion of the PWB. Due to the custom nature of every design, this guide is intended to be presented by the highly experienced J. Y. Circuit team
.

(1) Hole Is recommended to be located at least 0.075″ away from the transition area. The 0.075 zone is where rigid adhesive and flex cover meet and may impact the integrity of met all ized holes;
(2) RADIUS Minimum value to be 0.060″ to transfer the point of bend away from the sharp transition line;
(3) TEAR STOP Is recommended whenever space is permitted to reinforce the critical area from tearing;
(4) CONDUCTORA) Must be at least 0.050″ from the edge of the flex; and, B) Always perpendicular to the bend direction;
(5) ENLARGED CONDUCTOR Where possible, conductor should be enlarged through the transition and bend lines for added strength;
(6) BEND AREAB end Area or length is calculated by multiplying the thickness of the flex by 10 for 90 degree bend and by 12 for 180 degree. Should be no less than 0.300“
(7) FLEX MATERIAL Matching the material to the application is the most important note on the Fab Drawing. The following is the ranking from the best to the risky:
a)AP adhesive less
b)LF kapton acrylic
c)FR fire retardant
d) FR4 rigid material
This area is best discussed with PWB fabricator and the raw material supplier.

ROGER’S FR: 94-V0 Rated, XY Dimensionally Stable
Mechanical: Requires especial bend handling training
PTH: Not recommanded for high aspect ratio
*Material Cost 2X
DUPONT’S LF
(Acrylic System):
Mechanical: Supports optimum bend cycle
PTH: Not recommanded for high aspect ratio
*Material Cost 3X
DUPONT’S AP
(Adhesiveless System):
Mechanical: Supports optimum bend cycle
PTH: Highly recommanded for high aspect ratio
*Material Cost 4X
RIGID MATERIAL FR4 Mechanical: Risky, good for one to five bends
PTH: Same as standard PCB
*Material 1

 BENEFIT LIST

Overall, We Offer You A Compelling List Of Benefits: 

NRE 
Your Quick-turn Prototype to Volume under the same roof without additional NRE charges. As a standard practice, we tool both of them just the same.

TEST FIXTURE 
With our fixtureless testing, you can order as many prototypes(within a certain piece qty) without the sky-rocketing cost of test fixturing. You will incur this cost only when you have proven your design to go volume.

TECHNOLOGY 
Rigid-Flex, Flex, Rigid PCBs in a single stop

SIZE 
From PCMCIA to large Backplane

LAYER 
Combined with your high layer count(up to 35 Lyr) we will work with your simple requirements.