TECHNIQUE EXTENT
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Process Criteria
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Specification
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Normal
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Special
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| Min. Line/Spacing, external Layer | 4mil Over | 3mil below |
| Min. Line/Spacing, Internal Layer | 4mil Over | 3mil below |
| Min. Drilled Hole Size | 10mil | 8mil below |
| Aspect Ratio (Thickness to Min. Hole Diameter) | 10 | 20 |
| Land Size Internal (Diameter Over Drill) | Hole+0.3 | Hole+0.2 |
| Land Size External (Diameter Over Drill) | Hole+0.3 | Hole+0.2 |
| No-Connect (Diameter Over Drill) | 0.65 | |
| Plated Through Hole Tolerance | ±0.075 | ±0.05 |
| Min. Laser Via Hole | 0.127mm | 0.75mm |
| Laser Via Land Size (Diameter over Drill) | 0.25 | 0.175mm |
| Min. Dielectric Thickness | 0.09 | 0.05 |
| Min. Core Thickness | 0.1 | 0.06T |
| Max. PCB Thickness | 3.2mm | 6.4mm |
| Thickness Tolerance(%) | ≤10% | ≤5% |
| Max. Board Dimensions | 580X480 | 580X700 |
| Bow and Twist (Through Hole – %) | ≤1% | ≤0.60% |
| Bow and Twist (SMT – %) | ≤1% | ≤0.60% |
| Min Conductor to Edge (When rout) | 0.3 | 0.15 |
| Min Conductor to Edge (When V-Cut) | 0.75 | 0.5 |
| Layer To Layer Registration Tolerance | 0.1 | 0.06mm |
| Solder mask Clearance | 0.075mm | 0.06mm |
| Solder mask Dams | 0.08mm | 0.07mm |
| Impedance Tolerance(~ ohms +/- %) | 10% | 5% |
| Max. Layers | 28 | 48 |
| Max. Copper Weight Internal (Oz.) | 3OZ | 5OZ |
| Max. Copper Weight External (Oz.) | 3OZ | 5OZ |
| Electrical Test Method | 100 Mil Grid , 70 Mil Grid , Flying Probe | |
| Materials | CEM-1 and CEM-3 , FR-1 and FR-2 and FR-4 , FR-4 High TG | |
| Polyimide , Teflon , Rogers , FR-4 + Rogers , Metal Core , | ||
| Via Construction | Through Via , Blind and Buried Via , Laser Via | |
| Surface Finish | HSAL (Hot Solder Air Leveling ) , OSP (Organic Surface Protection) | |
| Immersion Tin Plating , Immersion Gold Plating , | ||
| Immersion Silver Plating , Electrolytic Gold Plating, ENEPIG | ||
CAPABILITY
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No
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Item
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Capability
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| 1 | Technology | Rigid (MLB), Flex & Rigid-Flex |
| 2 | Material | Rigid: GF, GI, Getek, BT, Polyimide, Teflon, 4003
Flex: Adhesive / Adhesiveless Polyimide base |
| 3 | Layer | 1Lyr to 48Lyrs+ |
| 4 | Via Interconnect | Thru-Hole, Blind, Buried |
| 5 | Drill Size | 0.008″ Mechanical: 0.004″ Laser |
| 6 | Aspect Ratio | 10:1 Thru-Hole: 0.5:1 Blind |
| 7 | Feature Size | 0.0036″/0.0036″ Line/Space |
| 8 | Impedance | +/- 10% (>70 ohm); +/- 10% /7%/5%(50 ohm) |
| 9 | SMT | 12mils Pitch |
| 10 | Finishes | SMOBC, Reflow, Gold Body, Selective Gold, Immersion Tin |
| 11 | Solder Mask | Liquid Photo Imageable (Flex and Rigid) |
| 12 | Electrical TEST | Double-sided Net list, 1~250V |
| 13 | Board Size | 24″ x 20″ |
QUALITY POLICY
J.Y. Circuit‘s policy is to integrate the manufacturing of Rigid-Flex, Flex and Rigid PCB’s in one efficient Linear Factory.
With the revolutionary Linear Production Methodology,
We aim to:
Provide the highest quality product, delivered on time and engineered to meet or exceed customer specifications
Support customers to become leaders in their market niche by providing the most appropriate use of the latest interconnect PCB technolog
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Reliability Test Equipments
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